geCKo Materials Showcases Versatile Adhesive Solutions at TechCrunch Disrupt

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geCKo Materials, the runner-up of the 2024 TechCrunch Disrupt Startup Battlefield, returned to this year’s event by introducing four new products that demonstrate the versatility and strength of its dry adhesive technology.

CEO Dr. Capella Kerst showcased the practical applications of geCKo’s adhesive, including a semiconductor wafer handling tool, a robotic gripper for smooth surfaces like solar panels, a curved robotic end effector for irregular shapes, and a versatile gripper for robotic arms. Inspired by the adhesive capabilities of lizards’ feet, geCKo’s technology offers a residue-free, reusable, and highly adhesive solution that can support significant weight and endure multiple attachments. The company’s dry adhesive has garnered interest from industry leaders such as Ford, NASA, and Pacific Gas & Electric.

Kerst highlighted geCKo Materials’ rapid growth, having tripled the team size and completed an $8 million fundraising round since the previous year. The company’s dry adhesive has even been utilized in space missions, proving its adaptability and reliability across diverse environments, including vacuum conditions.

During the TechCrunch Disrupt presentation, Kerst showcased how geCKo’s adhesive enhanced the efficiency of semiconductor wafer handling and robotic applications, demonstrating the technology’s capabilities.

Source: TechCrunch